Las Vegas, Nevada, USA (CES 2017) – January 4, 2017 – At the Consumer Electronics Show (CES 2017) this week, NXP Semiconductors NV (Nasdaq code: NXPI) will showcase how the world's top developers can achieve a safe, intelligent and connected future. With new solutions and partners, NXP continues to lead innovation in the security, IoT and automotive sectors.
New partnerships to create a secure and interconnected ecosystem for cars and deviceso NXP announced at CES 2017 that it will work with Microsoft to enhance the security of the Internet of Things. The new solution demonstrated during CES 2017 combines the best hardware and software security with a variety of other functions such as voice control and autonomous learning algorithms, which can be applied to smart homes, connected cars and intelligent networking devices. .
o From January 4th to 8th, Microsoft, NXP, IAV and partners Cubic Telecom, Esri and Swiss Re will work together to demonstrate their shared vision for safe and reliable end-to-end autonomous driving through highly automated driving demonstrations. As the US Department of Transportation mandates the adoption of vehicle-to-vehicle communication technology for new vehicles, the technology will become increasingly important.
o The new self-driving electric Rinspeed “Oasis†is being demonstrated in Las Vegas, which uses a large number of NXP technologies to ensure the safe interconnection of self-driving cars, including rake radar, V2X communication, and vehicle close-range communication. NFC, NPX BlueBox sensor, long-distance RFID, etc. The system can accurately monitor the surrounding environment of the car through advanced sensing technology.
o In order to drive innovation in future wearable technologies, NXP has also released the latest R&D test results. The results will support the development of products and applications for embedded security components, reflecting NXP's commitment to investing in secure payment, transaction, certification and other services for connected devices. NXP's results from this test have been completed by partners such as Palago and uConekt Inc.
Breakthrough automotive solutions will streamline the development processo NXP announces the launch of the world's first fully integrated software radio solution, the SAF4000, which is compatible with all broadcast audio standards worldwide including AM/FM, DAB+, DRM (+) and HD. This new IC combines six ICs to replace the multi-chip solution used today with a single ultra-compact RFCMOS device, achieving a major breakthrough in simplifying the high-performance infotainment platform.
Advanced IoT semiconductor technology meets ever-increasing user needs
o NXP announces the i.MX 8M family of application processors designed to meet the growing demand for audio and video systems for smart home and smart mobile applications. NXP's i.MX 8M series is responsive to the major shifts in streaming media: support for speech recognition and networked speakers in audio; and 4K high dynamic range (HDR) technology for video, making devices even smaller and more compact.
o NXP also introduced a new LPC MCU product roadmap based on the LPC800 and LPC54000 series, starting with ARM® Cortex®-M-based devices for next-generation consumer and industrial IoT applications.
o To ensure faster, more reliable network connectivity for smartphones, tablets, wearables and small IoT devices, NXP has introduced a new wireless local area network (WLAN) low noise amplifier (LNA) with fully integrated switches. In addition, NXP has introduced the easiest way to integrate NFC technology into a wearable device based on the Nexiwear platform, the new MikroElektronika NFC click. This new module uses the mikroBUSTM expansion board and the versatile NFC PN7 120 IC controller, which makes it easy to integrate NFC technology without any problems.
New solution brings the ultimate device charging experienceo NXP announces the industry's first type-c USB solution to power mobile phones, computing and all types of virtual reality devices in less than an hour. This end-to-end solution is the smallest in the market, with a unique fast charging technology and a USB baseband powered physical layer (PD PHY) device, making it the first solution to fully deploy a Type C transport controller.
o At CES 2017, NXP announced the first high-power wireless charging solution for notebooks and 2-in-1 tablets that delivers up to 100W of power across all power range requirements in the field. With a thickness of less than 2mm and a small number of components, this solution can be used for the most demanding industrial design requirements. Wireless charging products have been a popular accessory for smartphones and other small portable electronics. However, portable computing devices require far more power than the smart phone charger can provide. This latest NXP solution enables consumers to enjoy a true wireless experience while using laptops and 2-in-1 tablets, as well as meeting higher power requirements.
Exhibition and live demonstration during CESo NXP will conduct more than 100 product demonstrations during CES, ranging from the smallest microprocessors to complex network infrastructures, covering a wide range of products and technologies that support the smart world. These exhibitions will be held on the NXP caravan. In addition to the caravan, NXP will also showcase a range of solutions in a dedicated exhibition area. Unlike previous years, this year NXP will also showcase ADAS technology in the Autopilot Plaza in North Square.
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