Recently, Xiamen Tongshida Lighting Co., Ltd. announced that it will develop a new generation of lighting products using the "package-free" POD light source device from TSMC Solid State Lighting.
“After omitting the package, the overall cost of the LED components will be reduced again.†This is the “cost theory†frequently heard by reporters in the interview. The emergence of these "package-free chips" has made many packaging companies located in the middle of the LED industry chain feel "precarious." Is it a crisis and a battle? Still the best?
Opportunities and Challenges
"Package-free is not without packaging." The industry said that although the package-free technology has been proposed for some time, other companies in the country except Guangzhou Jingke have not yet mass production, so the market share is almost zero. According to industry insiders, in terms of LED lighting product manufacturing process, it is divided into Level0 to Level5 manufacturing process, in which Level0 is the process of epitaxial wafer and chip, while Level1 will package LED chip, Level2 will solder LED on PCB, Level3 For the LED module, Level 4 is the illumination source and Level 5 is the illumination system. The LED factory's unpackaged chip technology mostly omits the development of Level1.
“The package-free package is actually a gold-free package, but it is a gold-line package process.†Li Jiansheng, chairman of Shanghai Dinghui Technology Co., Ltd., said that all chip implants are packaged, and each device must be molded. To go through the packaging process. The package-free chips that appear on the market today are not unpackaged devices, and the two are fundamentally different.
“The packaging process may disappear, and the industrial chain becomes more likely to become two links.†Chen Bin, general manager of Guangdong Zhonglong Transportation Technology Co., Ltd. put forward three reasons: First, the improvement of chip technology is left to the process of packaging. The second is that the past LED application products do not form a relatively uniform standard light source, and the packaged LEDs must be reprocessed by the application manufacturer to form a usable light source. As the standardized light source becomes a major trend, the package link will be gradually compressed. Space; third, the intensification of market competition makes the profit space smaller and smaller, the upstream chip manufacturers will directly complete the packaging process, and even achieve the standardization of the light source.
"Packaging technology changes, traditional packaging companies will face a crisis of survival." Ruifeng Optoelectronics (300241) technical director Yan Xiaoming said that the current chip-level packaging technology, once mature, there may be upstream chip manufacturers directly skip packaging manufacturers Downstream application manufacturers provide lamp beads, and traditional mid-stream package manufacturers will be “short-circuitedâ€.
Chen Haijun, director of the Optoelectronics Research Institute of Ningbo Liaoyuan Lighting Co., Ltd., preliminarily judged that the upstream epitaxial chip companies will do a good job in the future, and large-scale general-purpose products can be directly selected. However, the characteristics of LEDs determine the variety of products. Therefore, a chip factory cannot meet all the application needs of downstream enterprises. LEDs will not only be used for lighting, so special forms, appearances, types, etc. are required for some special and customized applications. The package will still exist, but it is no longer a necessary link.
“Packaging-free is an inevitable trend in technology development.†Yan Chongguang, a professor at the Shanghai Institute of Microelectronics, Peking University, believes that LED chip manufacturing technology is undergoing major changes. The ELC chip without packaging has been developed and produced in Taiwan’s Jingyuan Optoelectronics two years ago. Success, Guangzhou Jingke Electronics is also in production. The high-voltage LEDs developed and produced by the LED chip factory, which are generated on the wafer, have also been released and promoted in some cities. However, small particle LED chips still need to be packaged for application.
Midstream packaging companies need to sit on the "revolution"
"The development trend will definitely bring great impact on LED packaging enterprises, but as the whole LED industry chain packaging link will not disappear." Ye Likang, deputy general manager of Xiamen Hualian Electronics Co., Ltd. believes that LED's existing applications are very extensive, and In the future, innovation will continue, and different applications must have the most suitable LED solutions. Therefore, various LED products will coexist and the packaging products have their own space. In addition, when chip-level package products are mature, chip flip-chip eutectic does not need to be packaged, LED products still need to solve a series of problems such as heat dissipation, optics, weather resistance, reliability, etc., packaging is indispensable.
In the view of Yan Chongguang, the LED packaging factory is the only way to develop modularization. The LED packaging factory can develop LED light source modules, develop multi-core packages, and develop "photoelectric engines" for driving power supply chips and LED light sources on the same side as aluminum substrates.
"Packaging companies can't disappear. The advancement of LED technology will give the packaging sector more market space and innovation space." Zhang Guang, general manager of Ningbo Shengyu Opto Semiconductors Co., Ltd. believes that the LED market has now penetrated into general lighting, landscape lighting, Special lighting, backlighting, and display include security equipment, home appliances, automobiles, communications and even more new areas, which will give packaging companies more room to grow. At present, LED lighting is in the era of replacement, and may enter the era of creative products in the future, but no matter what era, people's requirements for light quality will be higher and higher, and many of the technical problems can only be solved by the packaging process. With the development of new technologies, decapsulation will only be applied to some lighting products, but it is still unclear whether the products to be packaged can maintain high quality and high performance.
“Reviewing the packaging products a few years ago has also undergone great changes. This is the change in technology brought to the packaging.†In Zhang Sun’s view, LED packaging factories should actively adapt to this new change and innovate product structure. He predicted that there will be two main trends in packaging in the future. One is that standardized low-cost products are now mainstream products; the other is that high-level, high-applicability packaging products will be the mainstream products in the future, so packaging manufacturers should do well. Prepare for any changes.
Change "you die" to "interested interests"
“In the LED industry chain, the package is in the middle reaches and has been integrated upstream and downstream. Of course, some midstream package companies have also chosen to integrate downstream or upstream.†Industry forecasts, in the future, with the continuous integration of LEDs and the emergence of leading brands Packaging capacity will inevitably be concentrated in large enterprises. The improvement of technological processes will inevitably promote industrial development, promote product efficiency improvement and cost reduction, and accelerate popularization and penetration.
“The packaging process may be transferred directly to both ends of the industry.†Luo Wenzheng, general manager of Xi'an Company of Sichuan Xinli Light Source Co., Ltd. believes that there are many new technologies and processes for upstream chip manufacturing, such as wafer level packaging. In the chip manufacturing process, the packaging process is completed synchronously, and the packaging company is no longer required to separately package the package; on the other hand, the current packaging process is gradually being eaten by downstream lighting manufacturers, that is, directly integrated into a process of lamp manufacturing, such as these The COB technology that has developed very well in the year is very representative. Many lighting manufacturers have packaging links, and it is no longer necessary to purchase LED packaging devices from standard packaging manufacturers. From this point of view, if the mid-stream packaging enterprises want to "develop", they must be "close" to the upstream and downstream ends.
"Under the impact of non-packaging technology, the marketization and scale of the midstream packaging industry are inevitable in the future." A research center said that the realization of scale requires the integration of the industry chain up and down. On the one hand, it cooperates with chip companies, on the other hand, it enters the downstream application field. Since this gold-free and bracket-free packaging process can be directly completed by chip companies, packaging companies need to actively explore more living space upstream or downstream, such as using years of experience in the packaging field, and working with chip companies to complete the part. Process, etc.
"The integration of chip manufacturers and packaging manufacturers is an inevitable trend in the industry." Xiaoming Xiao also believes that some manufacturers have begun to try to integrate the midstream of the industry chain, and some enterprises even have the integration of the entire industry chain.
"Since the LED packaging will not disappear, who will do it will bring more value and convenience to the terminal products. Therefore, as an LED packaging company, it must be prepared for danger." Ye Likang put forward three suggestions: First, do a good job of positioning. Strive to achieve the top in the scale of the sub-sector; Second, through technological innovation, improve the packaging technology level, continue to reduce lumen costs and improve light color quality, keep up with COB, EMC and other technologies, and chip flip eutectic or The development of new technologies and new processes such as solder paste reflow soldering process, fluorescent film packaging, remote phosphors, etc.; the third is to give full play to the advantages of packaging companies to facilitate integration, to provide optimal packaging solutions for specific applications, and to extend downward Providing package modules with drive and control unit, through joint innovation with upstream and downstream, to meet the requirements of terminal product dimming, color adjustment, imitation solar spectrum, intelligence and so on. As long as the packaging enterprises do better than the upstream and downstream enterprises involved in the packaging process, and have more cost advantages, and can create real value for the end customers, they will be able to form a good pattern of mutual benefit and win-win in the LED industry chain.
(This article is reproduced on the Internet. The texts and opinions expressed in this article have not been confirmed by this site, nor do they represent the position of Gaogong LED. Readers need to verify the relevant content by themselves.)
“After omitting the package, the overall cost of the LED components will be reduced again.†This is the “cost theory†frequently heard by reporters in the interview. The emergence of these "package-free chips" has made many packaging companies located in the middle of the LED industry chain feel "precarious." Is it a crisis and a battle? Still the best?
Opportunities and Challenges
"Package-free is not without packaging." The industry said that although the package-free technology has been proposed for some time, other companies in the country except Guangzhou Jingke have not yet mass production, so the market share is almost zero. According to industry insiders, in terms of LED lighting product manufacturing process, it is divided into Level0 to Level5 manufacturing process, in which Level0 is the process of epitaxial wafer and chip, while Level1 will package LED chip, Level2 will solder LED on PCB, Level3 For the LED module, Level 4 is the illumination source and Level 5 is the illumination system. The LED factory's unpackaged chip technology mostly omits the development of Level1.
“The package-free package is actually a gold-free package, but it is a gold-line package process.†Li Jiansheng, chairman of Shanghai Dinghui Technology Co., Ltd., said that all chip implants are packaged, and each device must be molded. To go through the packaging process. The package-free chips that appear on the market today are not unpackaged devices, and the two are fundamentally different.
“The packaging process may disappear, and the industrial chain becomes more likely to become two links.†Chen Bin, general manager of Guangdong Zhonglong Transportation Technology Co., Ltd. put forward three reasons: First, the improvement of chip technology is left to the process of packaging. The second is that the past LED application products do not form a relatively uniform standard light source, and the packaged LEDs must be reprocessed by the application manufacturer to form a usable light source. As the standardized light source becomes a major trend, the package link will be gradually compressed. Space; third, the intensification of market competition makes the profit space smaller and smaller, the upstream chip manufacturers will directly complete the packaging process, and even achieve the standardization of the light source.
"Packaging technology changes, traditional packaging companies will face a crisis of survival." Ruifeng Optoelectronics (300241) technical director Yan Xiaoming said that the current chip-level packaging technology, once mature, there may be upstream chip manufacturers directly skip packaging manufacturers Downstream application manufacturers provide lamp beads, and traditional mid-stream package manufacturers will be “short-circuitedâ€.
Chen Haijun, director of the Optoelectronics Research Institute of Ningbo Liaoyuan Lighting Co., Ltd., preliminarily judged that the upstream epitaxial chip companies will do a good job in the future, and large-scale general-purpose products can be directly selected. However, the characteristics of LEDs determine the variety of products. Therefore, a chip factory cannot meet all the application needs of downstream enterprises. LEDs will not only be used for lighting, so special forms, appearances, types, etc. are required for some special and customized applications. The package will still exist, but it is no longer a necessary link.
“Packaging-free is an inevitable trend in technology development.†Yan Chongguang, a professor at the Shanghai Institute of Microelectronics, Peking University, believes that LED chip manufacturing technology is undergoing major changes. The ELC chip without packaging has been developed and produced in Taiwan’s Jingyuan Optoelectronics two years ago. Success, Guangzhou Jingke Electronics is also in production. The high-voltage LEDs developed and produced by the LED chip factory, which are generated on the wafer, have also been released and promoted in some cities. However, small particle LED chips still need to be packaged for application.
Midstream packaging companies need to sit on the "revolution"
"The development trend will definitely bring great impact on LED packaging enterprises, but as the whole LED industry chain packaging link will not disappear." Ye Likang, deputy general manager of Xiamen Hualian Electronics Co., Ltd. believes that LED's existing applications are very extensive, and In the future, innovation will continue, and different applications must have the most suitable LED solutions. Therefore, various LED products will coexist and the packaging products have their own space. In addition, when chip-level package products are mature, chip flip-chip eutectic does not need to be packaged, LED products still need to solve a series of problems such as heat dissipation, optics, weather resistance, reliability, etc., packaging is indispensable.
In the view of Yan Chongguang, the LED packaging factory is the only way to develop modularization. The LED packaging factory can develop LED light source modules, develop multi-core packages, and develop "photoelectric engines" for driving power supply chips and LED light sources on the same side as aluminum substrates.
"Packaging companies can't disappear. The advancement of LED technology will give the packaging sector more market space and innovation space." Zhang Guang, general manager of Ningbo Shengyu Opto Semiconductors Co., Ltd. believes that the LED market has now penetrated into general lighting, landscape lighting, Special lighting, backlighting, and display include security equipment, home appliances, automobiles, communications and even more new areas, which will give packaging companies more room to grow. At present, LED lighting is in the era of replacement, and may enter the era of creative products in the future, but no matter what era, people's requirements for light quality will be higher and higher, and many of the technical problems can only be solved by the packaging process. With the development of new technologies, decapsulation will only be applied to some lighting products, but it is still unclear whether the products to be packaged can maintain high quality and high performance.
“Reviewing the packaging products a few years ago has also undergone great changes. This is the change in technology brought to the packaging.†In Zhang Sun’s view, LED packaging factories should actively adapt to this new change and innovate product structure. He predicted that there will be two main trends in packaging in the future. One is that standardized low-cost products are now mainstream products; the other is that high-level, high-applicability packaging products will be the mainstream products in the future, so packaging manufacturers should do well. Prepare for any changes.
Change "you die" to "interested interests"
“In the LED industry chain, the package is in the middle reaches and has been integrated upstream and downstream. Of course, some midstream package companies have also chosen to integrate downstream or upstream.†Industry forecasts, in the future, with the continuous integration of LEDs and the emergence of leading brands Packaging capacity will inevitably be concentrated in large enterprises. The improvement of technological processes will inevitably promote industrial development, promote product efficiency improvement and cost reduction, and accelerate popularization and penetration.
“The packaging process may be transferred directly to both ends of the industry.†Luo Wenzheng, general manager of Xi'an Company of Sichuan Xinli Light Source Co., Ltd. believes that there are many new technologies and processes for upstream chip manufacturing, such as wafer level packaging. In the chip manufacturing process, the packaging process is completed synchronously, and the packaging company is no longer required to separately package the package; on the other hand, the current packaging process is gradually being eaten by downstream lighting manufacturers, that is, directly integrated into a process of lamp manufacturing, such as these The COB technology that has developed very well in the year is very representative. Many lighting manufacturers have packaging links, and it is no longer necessary to purchase LED packaging devices from standard packaging manufacturers. From this point of view, if the mid-stream packaging enterprises want to "develop", they must be "close" to the upstream and downstream ends.
"Under the impact of non-packaging technology, the marketization and scale of the midstream packaging industry are inevitable in the future." A research center said that the realization of scale requires the integration of the industry chain up and down. On the one hand, it cooperates with chip companies, on the other hand, it enters the downstream application field. Since this gold-free and bracket-free packaging process can be directly completed by chip companies, packaging companies need to actively explore more living space upstream or downstream, such as using years of experience in the packaging field, and working with chip companies to complete the part. Process, etc.
"The integration of chip manufacturers and packaging manufacturers is an inevitable trend in the industry." Xiaoming Xiao also believes that some manufacturers have begun to try to integrate the midstream of the industry chain, and some enterprises even have the integration of the entire industry chain.
"Since the LED packaging will not disappear, who will do it will bring more value and convenience to the terminal products. Therefore, as an LED packaging company, it must be prepared for danger." Ye Likang put forward three suggestions: First, do a good job of positioning. Strive to achieve the top in the scale of the sub-sector; Second, through technological innovation, improve the packaging technology level, continue to reduce lumen costs and improve light color quality, keep up with COB, EMC and other technologies, and chip flip eutectic or The development of new technologies and new processes such as solder paste reflow soldering process, fluorescent film packaging, remote phosphors, etc.; the third is to give full play to the advantages of packaging companies to facilitate integration, to provide optimal packaging solutions for specific applications, and to extend downward Providing package modules with drive and control unit, through joint innovation with upstream and downstream, to meet the requirements of terminal product dimming, color adjustment, imitation solar spectrum, intelligence and so on. As long as the packaging enterprises do better than the upstream and downstream enterprises involved in the packaging process, and have more cost advantages, and can create real value for the end customers, they will be able to form a good pattern of mutual benefit and win-win in the LED industry chain.
(This article is reproduced on the Internet. The texts and opinions expressed in this article have not been confirmed by this site, nor do they represent the position of Gaogong LED. Readers need to verify the relevant content by themselves.)
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