Chippen Microelectronics: How to integrate more peripheral components into the driver IC

[Text / high-tech LED reporter Gao Jinyu] The price of LED lighting terminal products continues to decline, bringing a lot of price reduction pressure to the supporting products such as driving power.

At present, the prices of capacitors, resistors, diodes and other devices have been very stable, and there will be no more room for price reduction in the short term. In this case, each of the drive power plants has proposed their own low-cost solutions, but there have been various invisible traps, which have sacrificed input voltage range, have abandoned safety requirements, and have high temperature work without proper protection measures. The “super-simplification” scheme that is easy to flash and even breaks through the quality safety bottom line presents a mixed situation.

Some experts in the industry believe that if some functions can be added to the IC, the application circuit may save a lot of components and save the production cost of the power board, but it must be based on the premise of not sacrificing performance and safety. The simplification of the peripheral circuit makes the drive power board have more space for heat dissipation and EMC in the narrow space inside the LED lamp. In the future, LED industry competition is a price-performance competition. The key is how to reduce the material cost, processing cost and production yield of LED drive power.

2014 China LED Lighting Supply Chain Good Product Tour Symposium Xiamen Station will be held in Xiamen Mingguan Hall on March 18th, and has been focusing on the development of green power management and driver chips for Wuxi Xinpeng Microelectronics Co., Ltd. (hereinafter referred to as “ "Jinpeng Microelectronics" will bring a keynote speech on "How to integrate more peripheral components into the driver IC".

Constantly improve the cost performance This is the goal of the LED lighting industry chain. "As a leading manufacturer of home appliance power chips, Chippen Microelectronics has accumulated years of experience in professional power IC design in high temperature and high humidity environments. We do not support the simple reduction of peripheral component specifications and reduction of protection devices by the client. Over the years, we have continued to reduce the overall cost of the system and improve performance by developing new technologies, such as increasing the anti-avalanche breakdown capability of high-voltage switch MOS to save RCD components, integrating self-starting high-voltage start-up tubes to eliminate peripheral high-voltage start-up resistors, etc., low-level Cutting corners and reducing costs will bring uncontrollable failure risks to the entire system,” said Xinpeng Microelectronics Yi Yangbo.

The core driver IC products of Xinpeng Microelectronics are characterized by innovative semiconductor integration technology, which mainly includes three aspects: integrating more devices into the IC to reduce the number of BOMs and reducing the internal resistance of the built-in MOS. Increase integrated power and add intelligent protection to reduce LED production line and after-sales failure. Dr. Yi said, “Complicated technology development should pursue the whole system to be simpler, simple is strength, simplicity is beauty.”

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