A brighter, longer-life LED technology is the first step in the $3 billion global high-power lighting market from research laboratories. The new production system, known as liquid forging, dramatically improves the cooling of small electronic devices and is expected to revolutionize next-generation LED production.
In the next decade, high-power LEDs are expected to replace traditional home and office lighting. The new production process, liquid forging, was developed by John Yong (leftmost) and his team (left to right) by Steven Tong Kin Kong, Chua Beng Wah and Ho Meng Kwong.
Many electronic parts require a heat sink to avoid burnout. As the global market expands by 10% per year, effective cooling is a serious engineering challenge for home, office and street lighting. The presence of heat can damage the luminaire, causing darkening or loss of efficiency. The top liquid forging method produced by the A-star Singapore Institute of Manufacturing Technology (SIMTech) provides solutions for the industry.
“Liquid forging is a hybrid between forging and casting,†says Chua Beng Wah, lead researcher at SIMTech. “It is especially suited to the need to produce brighter components with complex properties, such as with forged aluminum alloy radiators.â€
This process offers significant benefits to thermal engineers: the thermal conductivity of liquid forging products is up to 2 times higher than traditional techniques such as casting. “This method is very suitable for heat sink design,†adds Beng Wah.
In April of this year, Exploit Technologies Pte Ltd (ETPL), an A-star technology transfer department, licensed the patent to a leading LED thermal management company. The protocol allows the adoption of liquid forging process for producing lightweight, high-performance LED heat sink.
Liquid forging was developed by the SIMTech team led by John Yong. In 2008, Yong's team won the “National Science and Technology Awardâ€, Singapore's highest honor, for its excellent research.
The high scalability of the process allows complex parts – composites such as copper and aluminum – to be implemented in one step. This development project means that the heat sink and luminaire can be combined to significantly reduce assembly costs. The system also enables more flexible designs, such as complex plug and socket arrays, which increase surface area and improve heat dissipation. In the future, the final product will reduce the use of the machine, in part because the process can use raw materials more efficiently. The synthetic heat sink is capable of electroplating, which increases thermal performance by 10–15%.
However, liquid forging is not limited to the application of cooling LEDs. ET Lim CEO Philip Lim explains: “Liquid forging is a low-cost system that has advantages over traditional production processes in the compound, aerospace and automotive industries. Most importantly, this technology can be used for alloy rims, Electrical enclosure and piston."
The product will be available as early as 2013, and the future of this technology will be even brighter.
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