Text / Gaogong LED Editor Zeng Hongping
The LED industry chain is generally divided into upper, middle and lower reaches, which are LED epitaxial chips, LED packages and LED applications. As the LED package in the LED industry chain, it plays an indispensable role in the entire industry chain. Especially since the start of the semiconductor lighting project, it has received extensive attention, perhaps because the packaging industry directly faces the application market, or perhaps because the packaging industry is not much different from the international level, and its investment is not so large. The reason is that the L ED packaging industry has been rapidly developing. With the significant increase in the luminous efficiency of white LEDs, the application fields for high-brightness LEDs and white LEDs can be greatly expanded. At present, not only a series of special applications, military, aviation, landscape, table lamps, flashlights, miner's lamps, etc. are greatly improved, but in the field of updating, LCD backlight display, automotive applications, street lamps and other fields have also entered the practical application stage. The LED packaging industry not only has an excellent market development space, but also has a relatively healthy development of industrial platform support both domestically and abroad. It is no longer empty talk to build a world-class large-scale leading-edge packaging enterprise.
The gap with foreign packaging is narrowing. It is necessary to strengthen the upstream high-end product development.
At present, China's industrial advantage is mainly in packaging. From the perspective of regional distribution of packaging output value, China's packaging output value in 2008 was about 2.5 billion US dollars, which has surpassed Japan and Taiwan to become the world's largest packaging region, and has the core competitiveness of market and technology. China is a big LED packaging country. It is estimated that 80% of the world's LED device packaging is concentrated in China, and it is distributed in various US-funded, Taiwan-funded, Hong Kong-funded and domestic-funded packaging enterprises. In the past five years, foreign LED packaging companies have continued to move to the mainland, domestic packaging companies continue to grow and develop, and technology continues to mature and innovate. In the field of low-end LED device packaging, China's LED packaging companies have a high market share. In the field of high-end LED device packaging, some Chinese companies have made major breakthroughs. With the continuous maturity of process technology and the accumulation of brand reputation, China's LED packaging companies will play an important and leading role in China's LED application country. However, the state and the government have paid little attention to this. In the near future, Taiwanese companies and Japanese companies have moved to mainland China. At any time, they may form a distribution pattern in which Japan is the largest, Taiwan is in the United States, and Europe and South Korea are equally divided. We will once again lose our dominance and opportunities. Therefore, we should upgrade in the existing industrial advantages, work hard to package high-end products, and work hard in the direction of general lighting technology to break through the technical patent barriers of the LED industry and cultivate the competitive advantages of emerging markets.
The mid-stream packaging field is similar to the competition, and the horizontal integration needs are urgent. Â
The overall characteristics of China's midstream package field is that the barriers to entry are low, the scale of enterprises is small, the number is large, and the market competition is increasingly fierce. Orders are crucial to the survival and development of enterprises. Most manufacturers adopt low-price competition strategies and lack basic guarantees for product quality. If China's LED packaging enterprises want to achieve rapid and efficient development, it is difficult to achieve efficiency by the accumulation and strength of enterprises alone. It is necessary to use the power of the capital market to acquire mergers and mergers, and to achieve vertical integration. Some of the prophetic and ambitious Chinese LED packaging companies have begun to try to take advantage of the rapid development of China's existing capital market, horizontal and downward vertical integration, mergers and acquisitions of competitors in the industry, expansion of scale and channels, In order to catch up with powerful foreign companies. More typical LED packaging companies such as Shenzhen Lehman Optoelectronics have begun to hire securities institutions to conduct listing operations. If these LED packaging companies are successful, they will bring rapid development momentum to the Chinese LED industry and promote the development of upstream and downstream industries.
Enterprises in the downstream application sector will have polarization in the future.
According to experts' prediction, LED application products will be polarized, and general-purpose LED application products such as outdoor landscape lighting and interior decoration lighting will show a trend of integration with LED packaging enterprises. Specialized LED products such as military lighting and medical non-thermal radiation lighting Lamps, treatment lamps, germicidal lamps, special lamps for crops and flowers, bio-specific lamps, and special LED lamps combined with solar photovoltaic cells will be developed independently according to their respective characteristics, and will be specialized and divided in product development, design and production processes. Fine features.
Packaging technology to modular development Â
With the promotion of “Ten Cities and Ten Thousand Citiesâ€, the universal application of LED street lamps is also based on the characteristics of LED lamps. It is necessary to change the color temperature while maintaining a high color rendering index to meet different application needs. A new requirement - modularity - has also been proposed. Modularization is to use a light source, a heat dissipating component, and a driving power synthesis module to mass produce and standardize LED lighting products through the mold. Although the extension and chip cannot bypass the patent barriers of foreign companies, if the module is mass-produced, it has a price advantage, and the one-time, personalized production costs much higher. Therefore, modularization is the best choice for downstream LED lighting applications.
The module has remarkable features: First, the craftsmanship is good, and the modular street lamps are well repaired. Now most of the domestic street lamps use low-power chips. It is very inconvenient to repair a few broken ones, and the modularity is basically adopted. It is a high-power chip that is not easy to break, and it is easy to repair even if it is broken. Second, the development cost is reduced, and high-quality LED lighting products can be manufactured with less investment. LED street lights are 5 times more efficient than energy-saving lamps. If the module can achieve large-scale production, the cost can be reduced by 2 to 3 times. Although LED lamps are more expensive than energy-saving lamps, they save a lot more energy than energy-saving lamps. Many companies choose LED lamps because they can solve energy problems by spending a little more money, and in the long run, they are more economical.
Technology, chip supply, and intellectual property rights restrict the development of China's packaging industry
The reasons for restricting the development of China's LED packaging industry are technically: First, the key packaging materials: such as substrate materials, organic rubber (silica gel, epoxy resin), phosphors, etc., need to be improved. Second, the heat dissipation problem of high-power LED packaging technology has not been completely solved. Third, the package structure should be innovative for different applications. These technical problems need to be continuously improved by technical processes to overcome them. From the perspective of enterprise development, there are two key issues: First, the high-performance LED chips and power chips required for packaging cannot be purchased (except for some foreign companies), which comprehensively restricts the packaging production of high-end and high-power LED products. Second, key packaging technologies often contradict foreign packaging patents, such as white light packaging technology, power LED package cooling technology. If you want to scale the package production and export a large amount, you will encounter patent disputes. Another problem is the scale: scattered, small and lack of competitive strength, not only restricts the healthy promotion of the market and the effective development of new markets, but also suffers severely in the market possession. Due to the limitation of scale, the ability to invest in technology is extremely poor, which seriously affects the progress of packaging technology.
China's packaging needs to catch up. Need to increase investment in technology research
The LED industry generally believes that the gap between the technical level of China's LED packaging industry and the international level is not too large, and it is entirely possible to catch up with the world level. As far as the current situation is concerned, the rapid development of the domestic application market has spurred more international capital to intervene in the Chinese market, how to promote the development of national industry, and to be in an invincible position in the new round of competition and gain advantages. It is believed that it is of utmost importance to strengthen and strengthen the LED packaging industry, which is an important part of the application market. It is crucial to cultivate leading enterprises and large-scale enterprises to seize the opportunities and seize the market. In this regard, it should also attract great attention from the government and the industry. Of course, epitaxial chips, the speed of the new technology route must also accelerate development, otherwise China's LED industry can only be passive water, no roots.
At present, 80% of the government's support funds are spent on upstream extensions and chips, and insufficient support for midstream packaging and downstream applications. It is simply believed that only the upstream has technical content, which leads to unbalanced industrial development, and the most need to support the midstream and downstream enterprises. Send charcoal to the snow. In fact, the midstream package and downstream applications also have a certain technical content, and the leverage effect of the government to support capital investment is more obvious. We need to increase R&D investment in the research field of LED packaging technology, and both enterprises and governments should pay attention to it. In fact, the gap between China's LED packaging technology and foreign countries is mainly due to the gap in research and development investment. With the growth of China's national strength, we believe that China will become a strong LED packaging country.
Conclusion
LED packaging is a research topic involving multidisciplinary (such as optics, thermals, mechanics, electricity, mechanics, materials, semiconductors, etc.). In some ways, LED packaging is not only a manufacturing technology, but also a basic science. Good packaging requires understanding and application of physical properties such as thermal, optical, materials and process mechanics. The LED package design should be carried out simultaneously with the chip design, and the performance of light, heat, electricity, structure and other properties must be considered. In the packaging process, although the choice of materials (heat sink, phosphor, potting glue) is very important, the package structure (such as thermal interface, optical interface) has a great influence on LED light efficiency and reliability. High-power white LED package New materials, new processes, and new ideas must be adopted. For LED luminaires, it is necessary to integrate the light source, heat dissipation, power supply and lamps.
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