OFweek smart home network news now smart home sensors are basically integrated sensors, integrated sensors is the use of integrated circuit technology to semiconductor sensor components, measurement and processing circuit integrated into a chip made of cost-effective, easy to use miniaturized sensors.
Using integrated circuit technology and micro-machining methods, electromechanical sensitive components and processing circuits based on various physical effects can be integrated on a single chip to make Micro-Electro-Mechanical Systems (MEMS) sensors.
The size of the sensor-sensitive structure can reach micrometers and sub-micrometers, and can be mass-produced. It has the advantages of small size, light weight, fast response, high sensitivity, and low cost.
China's MEMS industry is at the forefront of the world, including American-invented sensors on American trains that log on to Mars. MEMS accelerometers and pressure sensors have been widely used in the automotive industry, such as the one in the smart home. The detection sensor is a typical application of MEMS.
MEMS not only rely on electronic technology, but also rely on mechanical processing technology.
The development of new technologies and new processes, such as integrated circuit technology and micro-machining technologies, has made it possible to integrate and miniaturize sensors. Sensitive elements fabricated using micromachining techniques are generally micrometers in size. Using anisotropic etching, sacrificial layer technology, and LIGA processes (ie, photolithography, electroforming, and injection molding), layers can be produced with large layers. Differential three-dimensional microstructures, including movable diaphragms, cantilever beams, bridges, and grooves, voids, cones, etc.
The single-chip integrated technology using a sensitive structure and a detection circuit can avoid the parasitic effect of lead pin introduction during multi-chip assembly, improve the performance of the device, and improve the anti-interference ability. The microsensors manufactured by microelectronics and micromachining technology have adopted a system-level packaging method and have a small size, light weight, low cost, low power consumption, high reliability, and suitability for mass production compared with conventional sensors. The characteristics of easy integration and intelligentization have already played a part in determining the system in the smart home.
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